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The new CHRocodile IT from Precitec Optronik now offers very simple and at the same time highly accurate layer thickness measurement for wafers and chips. It is capable of contact-free silicon scanning with just one measuring point and can measure a wafer precisely to a thickness of 1 mm.
The background to this new, non-destructive measuring process is a sensor that works with interferometry, using infrared light and not, as is usual, white light. Advantage: One measuring point with very bright light allows measuring speeds up to five times faster under the same conditions, and a measuring range that is ten times greater (up to 3.5 mm air gap) compared with the white light method. This allows the measuring unit to be integrated directly into the wafer production process thanks to its robust and simple configuration. Of course, CHRocodile IT is also ideal for economical and at the same time highly accurate layer thickness measurement in the laboratory.